…few-layer materials, and integrates electrodeposition with nanoscale electronic devices. The interdisciplinary consortium links chemistry, physics and electronic engineering. The initial contract runs to 31 December 2028, with a possible extension of up to three years. The salary is GBP 36,636–41,064. Submit a CV and cover letter by 23:59 UK time
Electrodeposition
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Integration of electric circuits into tailor-made 3D nanoprinted microscaffolds for neuronal network cultivation
Malte Siegmund, Jann Harberts, Tobias Müller et al. · FENS Forum 2024
Microelectrode arrays (MEAs) for non-invasive electrical readout of neurons are a valuable tool for long-term studies of neuronal network signaling on a single-cell level. However, conventional MEAs are built only in 2D and thus do not represent the three-dimensional network topology of the human brain. Here, we present an approach to equip planar MEAs with 3D microscaffolds featuring circuitry for enabling three-dimensional brain-on-a-chip devices with single-cell outgrowth control and electrical readout. Recently, we presented non-functional microscaffolds prepared by 3D nanoprinting (3DN) f
ePoster · Neuroscience