From Defect to Root Cause: Making Sense of Semiconductor Data

A semiconductor fabrication case study follows a defect from its initial discovery to a potential root cause. The speakers use wafer maps and graphical exploration to identify patterns, connect manufacturing-process and test measurements, and investigate trends across large datasets. The presentation shows how combining these data can narrow the possible causes of defects or changing yield. Drawing on the speakers’ semiconductor-industry experience, it addresses practical troubleshooting for process, yield, research, test and metrology teams and explains how visual analysis can make complex manufacturing data more useful.